| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_36f8253f3d0d59bcd9259217d4385d10 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0337
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3086
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31144 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-308
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065 |
| filingDate |
2002-04-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e1d85037308491c995223b3356d278a9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c5b9b317a5fede9c74928befd5b8a903 |
| publicationDate |
2004-02-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-1390971-A1 |
| titleOfInvention |
Method for removing polysilane from a semiconductor without stripping |
| abstract |
A method for removing polysilane from a semiconductor substrate without stripping during manufacture of a semiconductor device, comprising:a) coating a polysilane on a semiconductor substrate and coating a resist on the polysilane;b) patterning the resist with exposure and development;c) transferring the pattern from the resist to the polysilane using an etch process selective to the resist;d) stripping the resist;e) transferring the pattern from the polysilane to a hardmask using an etch selective to the hardmask;f) subjecting the polysilane to thermal or plasma/thermal oxidation to convert the polysilane to silica; andetching the substrate and stripping off the hard mask. |
| priorityDate |
2001-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |