| abstract |
A highly efficient method for cleaning a substrate,nwhereby in the cleaning of the substrate, 1 ○ in a shortntime, 2 ○ both particle contaminants and metalncontaminants can be removed, and 3 ○ a problem associatedntherewith, such as re-deposition of contaminants or andimensional change due to etching, can be remarkablynreduced, and which has the following characteristics. n A method for cleaning a surface of a substrate, whichncomprises at least the following steps (1) and (2), nwherein the step (2) is carried out after carrying outnthe step (1):n Step (1): A cleaning step of cleaning the surface ofnthe substrate with an alkaline cleaning agent containingna complexing agent, and Step (2): A cleaning step employing a cleaning agentnhaving a hydrofluoric acid content C (wt%) of from 0.03nto 3 wt%, wherein the cleaning time t (seconds) of thensubstrate with said cleaning agent is at most 45 seconds,nand C and t satisfy the relationship of 0.25≦tC 1.29 ≦5. |