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filingDate 2001-06-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b3555e88b309e951da8e60b041d2a600
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publicationDate 2003-05-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-1306726-A1
titleOfInvention Development defect preventing process and material
abstract A composition for reducing development defects comprising annacidic composition containing, for example, a surfactant appliednonto a chemically amplified photoresist coating formed on ansubstrate having a diameter of 8 inches or more. By this process,nthe surface of the resist is rendered hydrophilic and the formationnof slightly soluble layer in a developer on the surface of the resistnis prevented. In addition, by proper diffusion amount of acid fromnthe composition for reducing development defects, the amount ofnreduction in thickness of the chemically amplified photoresistncoating after development is increased by 10 Å to 500 Å in comparisonnwith the case of not applying the composition for reducingndevelopment defects to form a resist pattern not having andeteriorated pattern profile such as T-top or round top.
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