Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e96f3ee1454ffb6578f653ba5b9af958 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6708 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02222 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1212 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02282 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3122 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02343 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-122 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31058 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3125 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31053 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02126 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02211 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-312 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3105 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-316 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-306 |
filingDate |
2002-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d904054332b02568e609a68787ace96f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_00bd99a424413acf0b29fb648a92df73 |
publicationDate |
2003-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
EP-1296358-A2 |
titleOfInvention |
Process for producing semiconductor substrates |
abstract |
A process for producing semiconductor substrates withna coating film having an excellent chemical resistance withna high yield and an excellent production reliabilitynwithout any development of cracks and any generation ofnforeign matters due to a projected portion of the coatingnfilm is described, which includes the steps of:n (a) forming a coating film by coating an insulating film-formingncoating liquid on a substrate mounted on a rotatingndisc of a spin coater according to a spin coating method;nand then (b) removing a projected portion of the coating film formednat the periphery of the substrate by ejecting a solventnthrough a nozzle moving from any point on a line drawnnbetween the periphery edge and the center of the substratentoward the periphery edge while rotating the substrate. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2006071363-A2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-100587607-C http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1827712-A2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1827712-A4 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2007135556-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8408222-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/NL-1032067-C2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7838206-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7691559-B2 |
priorityDate |
2001-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |