| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fcc0b66123940d1b32783569ebfa2d45 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02P20-54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31663 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31138
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3122
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02343
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31133
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31695
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02216
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D183-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02282
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02126 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D183-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-316
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-312
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-311 |
| filingDate |
2002-06-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_707b65ed537e0dcdcd0ac90952ad93d5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bee50e65447e045d4dacda0c23cbbbf7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9dda10a0dfb0879bc0808df5632c0e25
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f07e51afdf7d05bd6286bcdce8196bfd |
| publicationDate |
2005-06-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-1267395-A3 |
| titleOfInvention |
Method for the formation of silica film, silica film, insulating film, and semiconductor device |
| abstract |
A method for the formation of a silica film which comprises treating a film in ansupercritical medium, the film comprising (A) a siloxane compound and (B) at least onenmember selected from the group consisting of (B-1) a compound compatible with or dispersiblenin ingredient (A) and having a boiling or decomposition temperature of from 150 to 500°C andn(B-2) a surfactant. The silica film has excellent mechanical strength showing a dielectricnconstant of generally 2.2 or lower, and hence is useful as a dielectric film in semiconductorndevices and the like. |
| priorityDate |
2001-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |