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filingDate 2001-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_09b4a036b0f6182f8a981ca400f6c01a
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publicationDate 2002-04-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-1199743-A2
titleOfInvention Method of fabricating a stack consisting of a layer of Si3N4 topped by a layer of SiO2 on a semiconductor substrate
abstract A method of fabricating a stack consisting of a layer ofnSi 3 N 4 topped by a layer of SiO 2 on a semiconductor substrateninvolves depositing the layer of Si 3 N 4 on the semiconductornsubstrate in a reactor in a NH 3 and bis(tert.-butylamino)silanenatmosphere at a temperature of 600 ton650°C and a pressure of 40 to 53 Pa and then depositing thenlayer of SiO 2 on the layer of Si 3 N 4 in the same reactor innan O 2 and bis(tert.-butylamino)silane atmosphere at antemperature of 600 to 650°C and a pressure of 40 to 53 Pa.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-03025248-A1
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type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 33.