| abstract |
A hard mask 105 of SiCN is formed on a fluorine-containingncarbon film 103. Thus, the adhesion of the hard mask 105 to thenfluorine-containing carbon 103 is improved and inhibited fromnbeing peeled off. The hard mask 105 of SiCN can have a highernetch-selectivity than those of conventional hard masks, and cannhave a lower dielectric constant than that of SiN or SiC. |