| abstract |
The present photo-curable resin composition,nat least one of which comprises an organic silicicncompound, an epoxy resin and a photo initiator capablenof polymerizing the organic silicic compound or epoxynresin upon absorption of actinic ray, undergoesnpolymerization and curing upon absorption of actinicnray, and is suitably applied to multilayered wiringnboards and semiconductor devices because its curednproduct can maintain a desired modulus of elasticity atntemperatures as high as or higher than Tg without anyndecrease in the bonding strength at elevated temperaturesnand with less development of cracks or peeling. |