| abstract |
A composition for film formation which is capable ofngiving a silica-based coating film having an exceeding lowndielectric constant and improved mechanical strength and usefulnas an interlayer insulating film in semiconductor devices andnthe like, a process for producing the composition, and ansilica-based film obtained from the composition. Thencomposition comprises (A) a product of hydrolysis andncondensation obtained by hydrolyzing and condensing one or morensilane compounds, and (B) an organic solvent. |