| abstract |
A method for forming a pattern of a photosensitive resin composition by which excellent sensitivity, film reduction rate and high resolution can be obtained by eliminating the occurrence of scums in a pattern processing process. In the method, the pattern is formed by applying a positive photosensitive resin composition composed of a polyamide having a specific structure and a diazoquinone compound to a substrate, etc., and, after the composition is pre-baked and irradiated with light, dissolving away the exposed part with an alkaline aqueous solution containing an anionic surface active agent and one or more kinds of compounds selected from among calcium, strontium, and barium compounds. The alkaline aqueous solution is characterized by being specially prepared as a developing solution. |