| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b73bb5b611ad02b686a7967bc6ca3412 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-2861
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-2852
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-2839
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-2809
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-2891 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J157-00 |
| filingDate |
1999-02-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7537b19cb8a6667db954316f654cc205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_55d528c4e78fb0ae20c96d0a05158766
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1d190738996e35c7791dab93e6a04138
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0a0bbe56c754b9064d9411b34dd02ea2 |
| publicationDate |
2001-01-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-1070347-A1 |
| titleOfInvention |
Semiconductor wafer processing tapes |
| abstract |
A semiconductor wafer processing tape includes a permanent backing and a layer of a nonpressure sensitive adhesive. The tapes are useful for wafer grinding and/or wafer dicing applications. The nonpressure sensitive adhesive includes a copolymer of at least one of a first monoethylenically unsaturated monomer, at least one of a second monoethylenically unsaturated monomer, and at least one copolymerizable nonionic cross-linking agent; wherein the second monoethylenically unsaturated monomer is reinforcing monomer having a homopolymer glass transition temperature higher than that of the first monoethylenically unsaturated monomer. A method of processing semiconductor wafers is also provided. |
| priorityDate |
1998-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |