| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_77387b1b9bc023eec7f13d42ecd85ea9 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 |
| filingDate |
2000-05-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ccad439000de84c8dc96468bdf8041a4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b188609690c0b2ab193d4183c4e1c1af
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_89981770aaae65a15f3fe6670c1826c5 |
| publicationDate |
2001-01-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-1069168-A1 |
| titleOfInvention |
Chemical mechanical abrasive composition for use in semiconductor processing |
| abstract |
A chemical mechanical abrasive composition for use in semiconductor processing,nwhich comprises phosphorous acid and/or a salt thereof as an abrasion enhancer. Thenchemical mechanical abrasive composition of the invention can be in the form of a slurrynand comprise from 70 to 99.5% by weight of an aqueous medium, from 0.1 to 25% bynweight of an abrasive and from 0.01 to 2% by weight of the said abrasion enhancer. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7553430-B2 |
| priorityDate |
1999-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |