| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-8319
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01015
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01012
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0102
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01019
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-8385
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01061
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01074
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0665
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2666-54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-07802
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-2919
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-122
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-302
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01004 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-83
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-385
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J9-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-062
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-06 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-58
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-22 |
| filingDate |
1997-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2006-01-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_be749b21d2f5cb56e52b9fefb3c5c0b4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fdf04a2dcb605207a5404b1ad66815ca
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e80710662b18d43e853131a7256169a5 |
| publicationDate |
2006-01-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-0942060-B1 |
| titleOfInvention |
Thermally conductive pressure-sensitive adhesive, adhesive sheet containing the same, and method for fixing electronic part to heat-radiating member with the same |
| abstract |
A thermally conductive pressure-sensitive adhesive which is excellent in thermal conductivity and adhesive properties, has a high adhesive strength especially at high temperatures (high holding power under high-temperature shear), undergoes no abrupt viscosity increase during or after adhesive production, and has excellent stability. The adhesive comprises: (a) 100 parts by weight of a copolymer of a monomer mixture comprising 70 to 99 wt.% monomers consisting mainly of alkyl (meth)acrylates in which the alkyls each has 2 to 14 carbon atoms on the average and 30 to 1 wt.% copolymerizable monomer having an acidic or basic polar group in the molecule; and (b) 10 to 300 parts by weight of a thermally conductive filler having the same polar groups as the copolymerizable monomer and a purity of 95 wt.% or higher. The adhesive sheet comprises a substrate and, formed thereon, a layer of the thermally conductive pressure-sensitive adhesive. The method for fixing an electronic part to a heat-radiating member comprises the use of the adhesive or the adhesive sheet. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102008049850-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8911642-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102008049849-A1 |
| priorityDate |
1996-12-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |