| abstract |
A semiconductor device, comprising: a semiconductor chip; a semiconductornchip attachment element facing the semiconductor chip, at least one interconnectnon the surface of the semiconductor chip attachment element; and at least onenmember that electrically connects the semiconductor chip with the interconnects;nwherein the semiconductor chip is bonded to the semiconductor chip attachmentnelement by an adhesive and at least a portion of at least one member thatnelectrically connects the semiconductor chip with at least one interconnect isnsealed or imbedded with a sealant/filling agent, and the complex modulus of atnleast one of the adhesive and the sealant/filling agent is not greater than 1 x 10 8 Panat -65 °C and a shear frequency of 10 Hz. The semiconductor device according tonthe present invention is characterized by an excellent resistance to thermal shock. |