| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c0f8dc752059a228fada0efdcc2901b9 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73203
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01019
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1301 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5328
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-563
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-60 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-532
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52 |
| filingDate |
1991-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_38f0a5aec527194a8b8e1e2a789532de
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c0b708160c0c226949c794f80e228b20 |
| publicationDate |
1992-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-0469614-A1 |
| titleOfInvention |
Flip-chip semiconductor device |
| abstract |
The present invention provides flip-chip type semiconductor devices wherein the electrical terminals (4) on the flip-chip element (1) are bonded to corresponding terminals (5) on the base plate (3) or other substrate using an electrically conductive silicone elastomer (6) exhibiting a specified range of Young's modulus values and the space between the passivated active surface of the flip-chip element and the substrate is filled with an electrically insulating elastomeric sealant (7). The use of the conductive silicone elastomer and the elastomeric sealant prolongs the useful life of the device. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6621173-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0800754-A4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0578307-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0578307-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0588609-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5670826-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0645805-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0645805-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6972495-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5635762-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5651179-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0893823-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10104779-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0800754-A1 |
| priorityDate |
1990-08-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |