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filingDate 1997-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6cac5d99575602c80d6edb7035524e0d
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publicationDate 1998-06-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-0849789-A2
titleOfInvention Method of etching a multilayer IC dielectric structure
abstract A method of etching an integrated circuit structure innwhich the gas flows into the etch plasma are changed toncompensate for the change in the etch chemistry which occursnwhen deep features (high aspect ratio) or multilayer structuresnare etched. This innovative process divides the etch intonmultiple steps and changes the etch parameters during each stagenof the etch in response to the materials being etched duringnthat stage of the etch.
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priorityDate 1996-12-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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