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filingDate 1997-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2dd330202c73201b4778d62e05f281a2
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publicationDate 1998-06-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-0848416-A1
titleOfInvention An etch process
abstract A method for etching a semiconductor device (10) havingnBARC layer (22) and nitride layer (20) includes etching BARCnlayer (22) until reaching a first set point in the fabricationnreaction chamber and then etching nitride layer (20) in-situnthe fabrication reaction chamber immediately following etchingnBARC layer (22).
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-02075796-A1
priorityDate 1996-12-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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