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filingDate 1993-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 1994-11-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-0625285-A1
titleOfInvention Method for anisotropically etching silicon
abstract The invention relates to a method for anisotropically attacking structures delimited with an attack mask, preferably recesses whose sides are exactly delimited, by means of a plasma. According to this process, both a high selectivity of the mask and a very strong anisotropy of the attacked structures are obtained. To this end, this anisotropic etching process comprises the successive separate and alternating polymerization and etching operations.
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priorityDate 1992-12-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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