| abstract |
A method for initiating and bonding thin films on substrates is described. The method employs an interlayer comprising a self-assembling monolayer (SAM). The SAM is formed from monomers, one end of which are capable of bonding to the substrate, and the other end of which form a surface similar to, and capable of initiating the formation of a film. n Additionally, compositions for monomers, methods for SAM formation, and methods for film formation are disclosed. In a preferred embodiment the thin film is comprised of diamond. |