| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_040ec81c891acc3f3186f56cb99cf161 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S257-90 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-094
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76802
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0274 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-522
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-302
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| filingDate |
1993-01-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5d2a37c343c275daacbc2abf620572e3 |
| publicationDate |
1993-09-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-0559323-A2 |
| titleOfInvention |
Improved method of patterning a submicron semiconductor layer |
| abstract |
An interlevel dielectric layer (24,26) is formed over the surface of the integrated circuit. A substantially planarizing layer (30) is formed over the interlevel dielectric layer (24,26). A photoresist layer (32) is formed and patterned over the planarizing layer (30). The planarizing layer (32) is etched to form openings (34) exposing selected portions of the interlevel dielectric layer (26,24), wherein each opening (24) has substantially the same lateral dimensions. The photoresist (32) and planarizing layers (26,24) are then removed. The interlevel dielectric layer (24,26) is etched in the openings to expose portions of the underlying integrated circuit. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-9704319-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-0019534-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6239026-B1 |
| priorityDate |
1992-01-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |