http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0537720-A1

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filingDate 1992-10-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c930de552b60a334019878f9bfdbd128
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publicationDate 1993-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-0537720-A1
titleOfInvention A method for ashing a photoresist resin film on a semiconductor wafer and an asher
abstract The object of the invention is to provide an ashing method and an asher, in order to avoid the damage to semiconductor components occurring during the ashing of a photoresist resin film by active oxygen plasma and to avoid the long treatment time occurring in an ashing method using a low pressure mercury discharge lamp. According to the invention this object is achieved by a method and an apparatus for ashing a photoresist resin film, in which a wafer provided with a photoresist resin film is placed in an ozone-containing atmosphere, an activated oxygen is produced through the radiation light of a discharge lamp, which emits a continuous spectrum in a wavelength range of 200 to 300 nm and the photoresist resin film is ashed by the activated oxygen.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/FR-2715742-A1
priorityDate 1991-10-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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