| abstract |
Radiation-sensitive compositions based on water as a solvent and / or dispersion medium for their components are described, which contain at least 10-50% by weight of water-soluble and / or dispersible, solid, crosslinkable, film-forming polymers as binders as components, 4- 50% by weight water-soluble and / or dispersible photopolymerizable acrylate and / or methacrylate monomers and / or corresponding oligomers, 0.1-10% by weight water-soluble and / or dispersible photoinitiator compounds for the photopolymerizable acrylate and / or Methacrylate monomers and / or corresponding oligomers and, if the binder contains non-self-crosslinking polymers, 2.5-40% by weight water-soluble or dispersible crosslinking agents for the binder polymers as thermal hardeners, selected from the group: epoxy resins, melamine resins and blocked polyisocyanates.n n n Compositions with carboxyl group-containing acrylate and methacrylate polymers or copolymers as binders are preferred, in each of which carboxyl groups are reacted with ammonia and / or certain amines, so that the binder is water-soluble.n n n The compositions mentioned can be photostructured and are particularly suitable as solder resist. |