http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0469401-A1

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filingDate 1991-07-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5fdb4ad2843eeb9bc55c5d43ecf9ba34
publicationDate 1992-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-0469401-A1
titleOfInvention Method of producing a semiconductor device by dry etching a SiO2 layer
abstract (Purpose) In the production method of a semiconductor device, it is an object of the present invention to achieve a dry etching method of which the selection rate for a silicon oxide layer is low and the processing time is shorter and by which reliability and yield are improved. n (Solution) An Si0 2 layer (3) serving as a first silicon oxide layer is formed by thermal oxidation on an aluminum wiring (2) which has been formed by vapor deposition on an Si-substrate (1), and an SOG layer (4) is applied by a spinner as a second silicon oxide layer onto the Si0 2 layer (3) having a ruggedness reflecting the steps in the aluminum wiring (2). A reactive ion etching is employed as the dry etching in an etchback process. The gas to be used is a mixed gas of C 2 F 6 (carbon fluoride gas) causing a liberation of fluorine radicals F * , and Ar (an inert gas).
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priorityDate 1990-07-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 46.