| abstract |
A method for increasing the resistance of a solid material surface against etching. It comprises the step of subjecting the surface to a chemical treatment which may be in a plasma, a liquid or a vapour containing reactive species that, reacting with the material (2) to be protected, form a thin native layer (5) that is highly resistant to an etchant subsequently applied. n Described is a fabrication process of a chromium mask for use in integrated circuit manufacturing. Initially, a glass plate (1) coated with a chromium film (2) is provided. After photoresist application (3), exposure to an e-beam pattern (4) and development the plate is subjected to a CF 4 + O 2 plasma treatment thereby forming a thin CrF 2 layer (5) on the chromium surface. This layer is shaped in accordance with the desired mask pattern. It is resistant against the chromium etch solution applied in a later process step. |