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filingDate 1994-08-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4ffd399d5135860c6be1d2daa1c1a782
publicationDate 1995-03-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber DE-4429902-A1
titleOfInvention Method of forming a fine pattern in a semiconductor device
abstract Method for forming a fine pattern in a semiconductor device, comprising the steps of: providing a target material layer, to be provided with a pattern and to be covered with a photosensitive film, on the upper side of the semiconductor substrate, selective exposure of the surface of the photosensitive film to define a region in the surface of the photosensitive film which is to be provided with a pattern, diffusing silicon into the surface of the photosensitive film by using hexamethyldisilane (HMDS) or tetramethyldisilane (TMDS) for forming a uniformly thin silanised photosensitive material film on a non-exposed surface of the photosensitive film and a thick silanised photosensitive material film in the form of a convex lens on the exposed surface of the photosensitive film, etching the silanised photosensitive material layer and the photosensitive film with a plasma that contains NF3/O2 with a predetermined thickness for removing the edge of the convex lens-shaped silanised photosensitive material in order to form a silanised photosensitive material pattern which defines in finely formed fashion the region to be provided with a pattern, and anisotropic etching of the photosensitive film exposed through the silanised photosensitive material pattern with an oxygen-based plasma for selective exposure of the ... Original abstract incomplete.
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