http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-2334658-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3043 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-302 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B26F3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065 |
| filingDate | 1973-07-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 1978-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | DE-2334658-B2 |
| titleOfInvention | Process for dicing semiconductor wafers |
| priorityDate | 1972-07-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 26.