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filingDate 2018-07-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3050782d8be5a43ec17380c220eaabcd
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publicationDate 2020-04-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber DE-112018003720-T5
titleOfInvention CUTTING PROCESS
abstract A cutting method comprises: forming a reformed area in a workpiece (1); and after forming the reformed area in the workpiece (1), cutting the workpiece (1) along an intended cutting line. When cutting the workpiece (1), a dry etching process is carried out from a front surface (3) to a rear surface (4) of the workpiece (1), while the workpiece (1) is attached to a carrier element at least under its own weight or by suction in order to form a groove on the front surface (3) in order to reach the rear surface (4) of the workpiece (1).
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