| abstract |
Semiconductor packages and package assemblies having active die and external die attachments on a silicon wafer and methods of fabricating such semiconductor package and package assemblies are described. In one example, a semiconductor package includes a semiconductor package having an active die attached to a silicon wafer through a first solder bump. A second solder bump is laterally outward of the active die on the silicon wafer to provide attachment for an external die. An epoxy layer may surround the active die and cover the silicon wafer. A hole may extend through the epoxy layer over the second solder bump to expose the second solder bump through the hole. Accordingly, an external memory die may be directly connected to the second solder bump on the silicon wafer through the hole. |