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filingDate 2010-02-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2012-07-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber DE-112010000953-T5
titleOfInvention A method of manufacturing a silicon carbide semiconductor device
abstract An epitaxial layer stacking which enables both reduction of the height of a step accumulation and reduction of crystal defects due to failure of migration of reactive species on a terrace is formed on a SiC semiconductor substrate with a deviation angle of 5 ° or less. In a period from a time t1 to a time t2, a layer of a first layer-forming epitaxial layer is formed on and in contact with a surface of the SiC semiconductor substrate with a deviation angle of 5 ° or less at a growth temperature T1. The temperature in a reactor is reduced from the growth temperature T1 to a growth temperature T2. In a period of time from a time t3 to a time t4, the epitaxial growth of a second layer-forming epitaxial layer on and in contact with a surface of the epitaxial layer constituting the first layer is carried out at the growth temperature T2 (<T1). In the manner described above, the epitaxial layer is formed with two layers, wherein the growth temperature for the second epitaxial layer is set lower than the growth temperature for the first epitaxial layer.
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