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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027
filingDate 2003-12-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_68e915eabbd82d62f9df44259b9d27ca
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_db804d75262044f911e03da012278476
publicationDate 2005-03-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber DE-10356177-A1
titleOfInvention Method for producing a semiconductor device
abstract A method of manufacturing a semiconductor device includes a process of forming a photoresist pattern. In the disclosed process, residual photoresist polymers are removed using a photoresist remover composition containing: DOLLAR A a) 5% to 15% sulfuric acid based on the total weight of said composition, DOLLAR A b) 1% to 5% hydrogen peroxide or 0, 0001% to 0.05% ozone, based on the total weight of the composition, DOLLAR A c) 0.1% to 5% acetic acid, based on the total weight of the composition, DOLLAR A d) 0.0001% to 0.5% ammonium fluoride , based on the total weight of the composition, and DOLLAR A e) as a residual amount of water.
priorityDate 2003-04-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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