| abstract |
Provided are a semiconductor device capable of accurately positioning a semiconductor element with respect to a metal circuit pattern or accurately positioning an insulating substrate with respect to a base plate without using a dedicated positioning device, which can be manufactured inexpensively, and a method for manufacturing the semiconductor device. The semiconductor device includes: an insulating substrate; and a semiconductor element, wherein the insulating substrate comprises an insulating layer and a metal circuit pattern arranged on an upper surface of the insulating layer, the semiconductor element is soldered to an upper surface of the metal circuit pattern, and an oxide film or a nitride film in a region where the semiconductor element is not soldered is located in the top surface of the metal circuit structure. |