| abstract |
Disclosed herein is an electrostatic chuck having a holding surface for holding a wafer with a tape attached to one side of the wafer in the state where the tape is in contact with the holding surface. The electrostatic chuck includes a disk-shaped member having a plurality of fine holes connected to a vacuum source, the fine holes exposed on the holding surface, a plurality of unevennesses formed on the holding surface and connected to the fine holes, and an electrode in the embedded disc-shaped element. When the vacuum source is operated to form a vacuum on the holding surface through the fine holes and thereby hold the wafer by the band on the holding surface and a suction, the unevenness formed on the holding surface serve as a suction passage that cooperates with connected to the fine holes. |