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filingDate 2015-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2812618f3b97bb4fdf230c45f03bf57e
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publicationDate 2016-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber DE-102015121532-A1
titleOfInvention Method for producing a silicon carbide component with a shielded gate
abstract There is formed a silicon carbide semiconductor substrate having a plurality of first doped regions laterally spaced apart and below a major surface and a second doped region extending from the major surface to a third doped region that is above the first doped regions. Fourth doped regions are formed extending from the main surface to the first doped regions. A gate trench is formed having a bottom disposed over a portion of one of the first doped regions. A high temperature step is performed on the substrate to reorient silicon carbide atoms along sidewalls of the trench and produce rounded corners in the gate trench. A surface layer that forms along the sidewalls of the gate trench during the high temperature step is removed from the substrate.
priorityDate 2014-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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