http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102014112671-A1

Outgoing Links

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-35
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-56
filingDate 2014-09-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_31e1c2f57c6252ae96d855f861e06e63
publicationDate 2016-01-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber DE-102014112671-A1
titleOfInvention Magnetron arrangement, processing arrangement and method for reactive sputtering
abstract According to various embodiments, a magnetron assembly (100) may include: a magnetron cathode (102k) having a material to be sputtered; a magnet assembly (102m) disposed relative to the magnetron cathode such that a plasma forming region (106) is provided over the material to be sputtered, wherein the plasma forming region comprises two elongated regions (106g) and two reverse regions (106k) annularly connecting the longitudinal regions ; a gas supply arrangement (108) having at least a first gas inlet (108a) and at least one second gas inlet (108b), wherein the gas supply arrangement (108) is arranged, the two longitudinally extending regions (106g) of the plasma formation region by means of the at least one first gas inlet (108a) to supply with a reactive gas (110a), and the two Umkehrbereiche (106k) of the plasma formation region by means of the at least one second gas inlet (108b) with an inert gas (110b) to flush such that in the two areas of reversal (106k) of the plasma formation substantially only the inert gas (110b) is present.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102015117845-A1
priorityDate 2014-07-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 23.