| abstract |
The present invention relates to polyamide molding compositions having improved heat aging resistance, having the following compositions: (A) from 25 to 84.99% by weight of at least one polyamide, (B) 15 to 70% by weight of at least one filling and reinforcing agent, (C) 0.01 to 5.0% by weight of at least one inorganic radical scavenger, (D) 0 to 5.0% by weight of at least one thermal stabilizer differing from the inorganic radical scavenger under (C), (E) 0 to 20.0 wt .-% of at least one additive. Furthermore, the invention relates to moldings produced from these polyamide molding compositions as components for the automotive or electrical / electronics sector. |