http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102013108147-A1

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filingDate 2013-07-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2014-09-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber DE-102013108147-A1
titleOfInvention Method and structure for vertical tunnel field effect transistor and planar devices
abstract The present disclosure provides an embodiment of a method of forming a tunnel field effect transistor (TFET). The method includes forming a semiconductor mesa on a semiconductor substrate; applying a first implant to the semiconductor substrate and the semiconductor mesa to form a drain of a first type of conductivity; forming a first dielectric layer on the semiconductor substrate and sidewalls of the semiconductor mesa; forming a gate stack on the sidewall of the semiconductor mesa and the first dielectric layer; forming a second dielectric layer on the first dielectric layer and the gate stack; and forming a source on the semiconductor mesa having a second type of conductivity that is opposite to the first type of conductivity. The gate stack includes a gate dielectric and a gate electrode on the gate dielectric. The source, drain and gate stack are configured to form the TFET.
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