http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102012206289-A1

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a5ea3215d4ccba707b78c4cf9133da5d
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-373
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4871
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-367
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3738
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3732
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3677
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-58
filingDate 2012-04-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6459d56d24b2a0b7c9f7a2ce9382ad57
publicationDate 2013-10-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber DE-102012206289-A1
titleOfInvention Semiconductor device composite structure with heat dissipation structure and associated manufacturing method
abstract According to the invention, a semiconductor device composite structure is provided, which has a starting substrate with discrete, integrated components and a heat dissipation structure. The heat dissipation structure comprises: a bonding layer deposited on the starting substrate or devices; a heat dissipating layer deposited on the bonding layer and made of a material having at least twice the specific thermal conductivity as the average specific thermal conductivity of the starting substrate or devices; and one or more metallic thermal bridges that thermally connect the devices to the heat sink layer through the bonding layer. The invention further relates to an associated manufacturing method.
priorityDate 2012-04-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102008063416-A1
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419549006
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID297
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID482532689
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419583196
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID9863
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID418354341
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID425270609
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559581
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5359268
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419491804
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID104727
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23978
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID69667
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23985

Total number of triples: 33.