| abstract |
The method according to the invention serves to produce optical components, in particular lids for the encapsulation of microsystems, wherein reinforcing elements, which are produced before the connection, are applied to a first substrate, whereby a stack is produced. This stack is heated after being connected to a second substrate, whereby the first substrate is deformed in such a way that at least one region of the first substrate covered by the reinforcing elements shifts and / or inclines. |