| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_962adbf7d50e742218f3d536a63df612 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2423-106
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68377
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2037-268
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-748
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-122 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-243
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-068 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-08 |
| filingDate |
2022-02-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_04fa688c7779cd0bba5b58a8fd1b41c7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_025e7811da0dc0af8ecc2c5081cd42c5 |
| publicationDate |
2022-10-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-115141571-A |
| titleOfInvention |
Support sheet, composite sheet for resin film formation, kit, and method for producing chip with resin film |
| abstract |
The present invention provides a support sheet (10), which is a support sheet (10) for heating a workpiece or a chip obtained by dividing the workpiece, and is arranged in any direction in the conveying direction (MD) or the vertical direction (CD). When the thermal mechanical analysis ( TMA ) of the support sheet (10) with the sample size of 20 mm in length and 5 mm in width is carried out in the tensile mode of The average displacement per 1°C (A 23→130 ) is smaller than the absolute value of the average displacement per 1°C (|B 130→50 |) when cooling from 130°C to 50°C slowly. |
| priorityDate |
2021-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |