http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114994484-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_28acae028f5650a09918ce2094a9c106 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01K7-01 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2855 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2642 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01L1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01K7-22 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01K7-01 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01K7-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01L1-22 |
| filingDate | 2022-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_10d27e42fe700a55e30fd5b10291cf48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_81f6d9c1b8cbc045af525ccd89bdf1db http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e11edae39b8fd8e3d5c492512cf53afc http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b9713855422e1ae9cc1ee35776ef9132 |
| publicationDate | 2022-09-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-114994484-A |
| titleOfInvention | A test chip for simulation verification |
| abstract | The invention relates to the technical field of integrated circuits, in particular to a test chip for simulation verification. It includes three test capabilities of electricity, heat and force. Electric test includes square wave generator, tri-state buffer, electromigration test, etc.; thermal test includes heating resistance, temperature measuring diode, etc.; force test includes both sides of horizontal plane XY Toward stress test. The test chip used for simulation verification designs the above-mentioned devices and functions on a silicon wafer through a semiconductor process, each silicon wafer unit includes all the above-mentioned functions, and different units can be cascaded on the silicon wafer to form a customizable size of the test chip. Compared with the conventional test chip, the present invention has more complete integrated test functions, and the size can be directly cut as required, and has higher versatility and reliability. |
| priorityDate | 2022-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559541 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5461123 |
Total number of triples: 24.