| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-312
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-502
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-3495
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J4-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-52 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J4-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00 |
| filingDate |
2020-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_756abad9d567968972c09075016e582c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8d0d78451b823acf2a8bdd86538acdca |
| publicationDate |
2022-08-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-114846102-A |
| titleOfInvention |
adhesive sheet |
| abstract |
To provide a pressure-sensitive adhesive sheet that can temporarily fix small electronic components (for example, chips having a size of 50 μm□ or less) well and can be peeled off well. The pressure-sensitive adhesive sheet of the present invention includes a pressure-sensitive adhesive layer containing an active energy ray-curable pressure-sensitive adhesive, the light transmittance at a wavelength of 360 nm of the pressure-sensitive adhesive sheet is 0% to 35%, and the light transmittance at a wavelength of 380 nm of the pressure-sensitive adhesive sheet is provided. The light rate is 10% to 100%. In one embodiment, the initial adhesive force at 23° C. when the above-mentioned pressure-sensitive adhesive sheet is attached to a stainless steel plate is 0.3 N/20 mm to 15 N/20 mm. In one embodiment, the adhesive force at 23° C. after the above-mentioned pressure-sensitive adhesive sheet is attached to a stainless steel plate and irradiated with ultraviolet rays of 460 mJ/cm 2 is 0.01 N/20 mm to 2.4 N/20 mm. |
| priorityDate |
2019-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |