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filingDate 2020-08-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2022-02-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-114072540-A
titleOfInvention Manufacturing method of semiconductor device, substrate processing apparatus and program
abstract The present invention includes a film-forming step of forming a film containing a predetermined element and nitrogen on a substrate by performing a predetermined number of cycles including the following (a) to (c): (a) heating in the processing chamber until the first A step of forming a first layer by supplying a raw material gas containing a predetermined element and a halogen to a substrate at a temperature; (b) supplying a plasma-excited first reforming gas containing hydrogen and no nitrogen to the substrate in the processing chamber, so that The step of reforming the first layer to form the second layer; and (c) supplying a plasma-excited second reforming gas containing nitrogen and hydrogen to the substrate in the processing chamber to reform the second layer to form the third layer The step of layering, wherein the supply time TH of the first reforming gas in (b) is set to be longer than the supply time TN of the second reforming gas in (c).
priorityDate 2019-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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