| abstract |
The present invention relates to a substrate processing method and a substrate processing system, which can appropriately perform a static elimination treatment on a substrate after plasma treatment. The substrate processing method is used for processing a substrate, and includes the following steps: step (a), placing the substrate on an electrostatic chuck, and applying a DC voltage to the electrostatic chuck, thereby attracting the substrate to the electrostatic chuck. the electrostatic chuck; step (b), supplying high-frequency power to the electrode, and using an inert gas to generate plasma; step (c), stopping the application of the DC voltage to the electrostatic chuck; and step (d), making The high-frequency power supplied to the electrodes was gradually reduced, and the high-frequency power was set to 0W. |