| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29339
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-2939
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2463-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-314
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-408
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-0806
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2400-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29499
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-2929 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3737
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-30 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-488
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-373
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 |
| filingDate |
2020-08-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2022-12-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2022-12-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-112430443-B |
| titleOfInvention |
Thermally conductive adhesive sheet, method of manufacturing thermally conductive adhesive sheet, and semiconductor device |
| abstract |
The thermally conductive adhesive sheet of the present invention is a thermally conductive adhesive formed by molding a resin composition containing (A) silver particles, (B) thermosetting resin, and (C) binder resin into a sheet shape. The sheet for use is characterized in that the (A) silver particles are secondary particles formed by agglomerating particles including primary particles with an average particle diameter of 10 to 100 nm. |
| priorityDate |
2019-08-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |