| abstract |
A method for depositing a layer on a substrate is provided. A plurality of plasma atomic layer deposition (ALD) layers are deposited over the substrate, wherein each plasma ALD layer of the plurality of ALD layers is deposited at a first RF power. The plurality of plasma ALD layers are densified, which includes generating a densified plasma using a second RF power greater than the first RF power, wherein at least one of the plurality of plasma ALD layers is densified. |