| abstract |
The invention discloses a sealing method for a ceramic capacitive pressure sensor chip. The method includes: 1. grinding, cleaning and drying the surface of the ceramic substrate; 2. screen printing glass paste on the substrate; 3. drying treatment; 4. pressure sintering; , Secondary sintering molding. The ceramic capacitive pressure sensor chip prepared by the invention is tested by fluorine oil and helium gas tightness, and the sealing performance is good, the bonding strength of the pressure elastic sheet and the ceramic base is greater than 40MPa, and the distance between the ceramic elastic sheet and the ceramic base can be controlled within 10 μm to 50 μm. The invention has the advantages of simple process, good sealing effect, high bonding strength, good controllability of capacitor spacing and the like. |