| abstract |
The present invention relates to a urea-based additive; a method for its preparation; the urea-based additive is advantageously used as an additive in a metal or metal alloy deposition composition, preferably a copper or copper alloy deposition composition, more preferably as an additive in a copper or copper alloy deposition composition Use of leveling agents and/or inhibitors therein; Metal or metal alloy deposition compositions comprising said urea-based additive and use of such compositions; Use of metal or metal alloy layers, preferably copper or copper alloys Methods of electrolytic deposition of layers on at least one surface of a substrate and metal or metal alloy layers formed from the above metal or metal alloy deposition compositions. For example, in the case of copper electroplating, especially when filling recesses, the urea-based additives allow for very flat copper deposits free of voids. |