| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c8401bd1a86a10d5508942a53475fc38 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-00 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-58
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 |
| filingDate |
2016-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c2ad1c3ad155342e38849d635d60ffc7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_897fc2c9a55397b7d7770862d6715698
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_563ed22bcbd6be9a363d8c7652942c27
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6f9f84caa48be31817fbffdfd6968daa |
| publicationDate |
2018-04-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-107923060-A |
| titleOfInvention |
Aqueous copper plating bath and method for depositing copper or copper alloy onto a substrate |
| abstract |
The present invention relates to diurea derivatives and their use in aqueous plating baths for the deposition of copper and copper alloys in the manufacture of printed circuit boards, IC substrates, semiconductors and glass devices for electronic applications. The plating baths of the present invention comprise at least one source of copper ions and a diurea derivative. This plating bath is particularly useful for the construction of filling recessed structures and pillar-like raised structures with copper. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111566259-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111566259-A |
| priorityDate |
2015-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |