abstract |
The present application discloses an etchant composition and a method of fabricating a semiconductor device, the composition comprising: an inorganic acid; about 0.01 parts by weight to about 0.5 parts by weight colloidal silica; about 0.01 parts by weight to about 30 parts by weight an ammonium-based additive; and about 20 parts by weight to about 50 parts by weight of a solvent, all of which are based on 100 parts by weight of the inorganic acid. |