http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111393714-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-164 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-003 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02P20-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-3081 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K5-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B35-622 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B35-583 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K9-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K13-06 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K5-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C04B35-583 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C04B35-622 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K13-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K9-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-38 |
| filingDate | 2020-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-11-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2021-11-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-111393714-B |
| titleOfInvention | Preparation method of boron nitride composite structure filler for interface heat conduction material |
| abstract | The invention relates to a preparation technology of an interface heat conduction material, and aims to provide a preparation method of a boron nitride composite structure filler for the interface heat conduction material. The method comprises the following steps: carrying out hydrophilic treatment on the boron nitride powder by using a sodium hydroxide solution; adding the treated boron nitride powder into a metal inorganic salt aqueous solution, and stirring at normal temperature; filtering but not cleaning, putting the wet powder into a tube furnace, and sintering in an oxygen atmosphere to obtain powder, namely the boron nitride composite structure filler. According to the invention, rod-shaped metal oxide particles are grown among the boron nitride sheets, so that the number of efficient heat conduction paths among the boron nitride sheets is increased, the interface thermal resistance of the whole system filler is reduced, and the heat conductivity coefficient is increased. The low dielectric constant of the silicone oil can be well utilized on the premise of ensuring the heat conductivity coefficient, so that the dielectric constant of the final heat conduction material is less than 4. The invention has the advantages of easily obtained raw materials, simple preparation process and low cost, and can be applied to large-scale industrial production. |
| priorityDate | 2020-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 85.